Wookey wrote:
> +++ Paul Fidler [05-01-19 19:04 +0000]:
>> I just thought I'd update the list with the latest developments. After
>> sending some scanned pictures to Steve and Wookey, they both spotted a
>> blob of solder between the tracks going to D10 and NIOCS16.
 > ...
> And (as I said to Paul in the pub on Friday (samll place, Cambridge)) he was
> unfortunate to have one of the first batch of balloons, made before we had
> XJTAG digital done on the boards, which is designed to spot exactly this
> kind of manaufacturing fault - shorts, dry joints, duff silicon (anything
> that can be tested with static logic).
> 
> On any current production this would have been noticed at test-time and
> saved a lot of faffing about.

Good point, this: I'm not rightly sure how thoroughly the XJTAG test 
deals with the CF connector. It may not be aware of anything beyond the 
bus buffers - I'll add it to my to-do list.

Chris